View BD3021HFP_8725236.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

product structure silicon monolithic integrated circuit this product is not designed prot ection against radioactive rays . 1/24 tsz02201-0g1g0an00480-1-2 ? 2013 rohm co., ltd. all rights reserved. 10.nov.2015 rev.001 tsz22111 ? 14 ? 001 www.rohm.com . . . . . . . . . . . . . . ldo regulators with watch-dog timer 500ma output ldo regulators with voltage detector and watchdog timer bd3020hfp BD3021HFP general description bd3020hfp BD3021HFP is a regulator ic with integrated wdt (watch dog timer), high output voltage accuracy 2.0 % and 80 a (typ) low circuit current consumption. these are supports usage of low esr ceramic capacitor for output stability. the reset detection voltage can be adjusted by connecting resistors on the vs terminal (bd3020hfp). they can be a stable power supply for any applications while detecting malfunction of microcontrollers. features ? integrated wdt reset circuit [bd3020hfp]: adjustable detection voltage through vs pin [BD3021HFP]: wdt can be switched on / off by using inh pin ? low saturation voltage by using pmos output transistor ? vcc max voltage: 50 v ? integrated over current protection and thermal shut down ? hrp7 package key specification ? low circuit current: 80 a (typ) ? output voltage: 5.0 v (typ) ? output current: 500 ma ? high output voltage accuracy: 2 % ? low esr ceramic capacitor can be used as output capacitor package w (typ) d (typ) h (max) ? hrp7 9.395 mm 10.540 mm 2.005 mm figure 1. package outlook applications ? automotive (body, audio system, navigation system, etc.) typical application circuits figure 2. typical application circuits bd3020hfp BD3021HFP datashee t downloaded from: http:///
datasheet d a t a s h e e t . 2/24 tsz02201-0g1g0an00480-1-2 ? 2015 rohm co., ltd. all rights reserved. 10.nov.2015 rev.001 tsz22111 ? 15 ? 001 bd3020hfp BD3021HFP www.rohm.com ordering information b d 3 0 2 x h f p - t r pin configuration figure 3. pin configuration pin description pin no. pin name function 1 clk clock input from microcontroller 2 vs (bd3020hfp) reset detection voltage set pin inh (BD3021HFP) wdt on/off function pin 3 vcc power supply pin 4 gnd gnd 5 vout voltage output pin 6 reset reset output pin 7 ct external capacitance for reset output delay time, wdt monitor time setting connection pin fin gnd gnd block diagram <BD3021HFP> figure 4. block diagrams (top view) 1 2 3 4 5 6 7 fin package hfp: hrp7 taping tr: reel-wound embossed tamping part number 3020 3021 downloaded from: http:///
datasheet d a t a s h e e t . 3/24 tsz02201-0g1g0an00480-1-2 ? 2015 rohm co., ltd. all rights reserved. 10.nov.2015 rev.001 tsz22111 ? 15 ? 001 bd3020hfp BD3021HFP www.rohm.com absolute maximum ratings (ta = 25 c) parameter symbol ratings unit supply voltage (1) v cc -0.3 to +50.0 v vs pin voltage (bd3020hfp) vs -0.3 to +15.0 v inh pin voltage (BD3021HFP) v inh -0.3 to +15.0 v regulator output pin voltage v out -0.3 to +15.0 v reset output pin voltage v reset -0.3 to +15.0 v watchdog input pin voltage v clk -0.3 to +15.0 v reset delay setting pin voltage v ct -0.3 to +15.0 v power dissipation (2) pd 1.6 w operating temperature range topr -40 to +125 c storage temperature range tstg -55 to +150 c maximum junction temperature tjmax 150 c (1) pd should not be exceeded. (2) hrp7 mounted on 70.0 mm 70.0 mm 1.6 mmt glass-epoxy pcb. if ta 25 c, reduce by 12.8 mw / c. (1-layer pcb: copper foil area on the reverse side of pcb: 0 mm 0 mm) caution: operating the ic over the absolute maximum ratings may damage the ic. the damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. theref ore, it is important to consider circuit protection measures, such as adding a fuse, in case the ic is operated over the absolute maximum ratings. operating conditions (-40c ta +125 c) parameter symbol min max unit supply voltage (3) v cc 5.6 36.0 v output current io 0 500 ma (3) for the output voltage, consider the voltage drop (dropout voltage) due to the output current. downloaded from: http:///
datasheet d a t a s h e e t . 4/24 tsz02201-0g1g0an00480-1-2 ? 2015 rohm co., ltd. all rights reserved. 10.nov.2015 rev.001 tsz22111 ? 15 ? 001 bd3020hfp BD3021HFP www.rohm.com electrical characteristics (unless otherwise specified, -40c ta +125 c , v cc = 13.5 v, v clk = gnd) parameter symbol limit unit conditions min typ max overall device bias current 1 icc1 80 130 a io = 0 ma bias current 2 icc2 150 300 a io = 50 ma (ta = 25 c) regulator output voltage v out 4.90 5.00 5.10 v io = 200 ma line regulation line.reg 5 35 mv 5.6 v v cc 36 v load regulation load.reg 30 70 mv 5 ma io 200 ma dropout voltage ? vd 0.3 0.6 v v cc = 4.75 v, io = 200 ma ripple rejection r.r. 45 55 db f = 120hz, ein = 1 vrms, io = 100 ma reset detection voltage (bd3020hfp vdet 4.02 4.10 4.18 v detection voltage (BD3021HFP) vdet 4.40 4.50 4.60 v hysteresis width v hs 50 100 150 mv output delay time low ? high (power on reset time) t dlh 1.1 1.9 2.7 ms v cc = vdet 0.5 v (v cc = v out ) inh = open (1) , c ct = 0.01 f output delay time high low t dhl 100 300 s v cc = vdet 0.5 v (v cc = v out ) inh = open (1) , c ct = 0.01 f reset discharge current i reset 0.2 ma v cc = 1.5 v, v reset = 0.5 v (v cc = v out ) ct discharge current ict 0.1 ma v cc = 1.5 v, v ct = 0.5 v (v cc = v out ) low output voltage v rst 0.1 0.2 v v out = 4.0 v min operating voltage v opl 1.5 v (1) BD3021HFP only downloaded from: http:///
datasheet d a t a s h e e t . 5/24 tsz02201-0g1g0an00480-1-2 ? 2015 rohm co., ltd. all rights reserved. 10.nov.2015 rev.001 tsz22111 ? 15 ? 001 bd3020hfp BD3021HFP www.rohm.com electrical characteristics (unless otherwise specified, -40c, ta +125 c , v cc = 13.5 v, v clk = gnd) parameter symbol limit unit conditions min typ max watchdog timer ct switching threshold voltage high vthh 1.08 1.15 1.25 v wdt on (1) , inh = open (1) ct switching threshold voltage low vthl 0.13 0.15 0.17 v wdt on (1) , inh = open (1) wdt charge current ictc 3.5 6.0 8.5 a wdt on (1) , inh = open (1) v ct = 0 v wdt discharge current ictd 1.2 2.0 2.8 a wdt on (1) , inh = open (1) v ct = 1.3 v watchdog monitor time low t wh 3.0 5.0 7.0 ms wdt on (1) , inh = open (1) , c ct = 0.01 f ( ceramic capacitor ) (2) watchdog reset time t wl 1.0 1.7 2.4 ms clk input pulse width t wclk 500 - - ns inh * wdt off threshold voltage v hinh v out 0.8 - v out v wdt on threshold voltage v linh 0 - v out 0.3 v inh is pulled down inside the ic when inh open. inh input current i inh - 10 20 a v inh = 5 v (1) BD3021HFP only (2) characteristics of ceramic capacitor not considered. downloaded from: http:///
datasheet d a t a s h e e t . 6/24 tsz02201-0g1g0an00480-1-2 ? 2015 rohm co., ltd. all rights reserved. 10.nov.2015 rev.001 tsz22111 ? 15 ? 001 bd3020hfp BD3021HFP www.rohm.com reference data unless otherwise specified, ta = 25 c, v cc = 13.5 v, v clk = gnd 0 20 40 60 80 100 120 0 5 10 15 20 25 su ppl y vol tage : vc c [v] circuit current : icc1[ a] 0 1 2 3 4 5 6 0.0 0.2 0.4 0.6 0.8 1.0 1.2 output current : io[a] output voltage : vout[v ] figure 5. circuit current 1 figure 8. lode stability figure 6. circuit current 2 figure 7. input stability -40c 25c 125c 0 1 2 3 4 5 6 0 5 10 15 20 25 output voltage: vout[v] supply voltage : vcc[v] -40c 25c 125c -40c 25c 125c 0 100 200 300 400 500 0 100 200 300 400 500 circuit current: icc2 [a] output current: io [m a] downloaded from: http:///
datasheet d a t a s h e e t . 7/24 tsz02201-0g1g0an00480-1-2 ? 2015 rohm co., ltd. all rights reserved. 10.nov.2015 rev.001 tsz22111 ? 15 ? 001 bd3020hfp BD3021HFP www.rohm.com reference data unless otherwise specified, ta = 25 c, v cc = 13.5 v, v clk = gnd 0 10 20 30 40 50 60 70 80 10 100 1000 10000 100000 1000000 frequency : f[hz] ripple rejection : r.r.[db] 0 1 2 3 4 5 6 100 120 140 160 180 200 ambient temperature : ta[ ] output voltage : vout[v] . figure 9. dropout voltage figure 11. output voltage temperature characteristics figure 12. thermal shutdown circuit characteristics figure 10. ripple rejection 0.0 0.2 0.4 0.6 0.8 1.0 0 100 200 300 400 500 output current : io[m a] dropout voltage : vd[v] 4.50 4.75 5.00 5.25 5.50 -40 0 40 80 120 ambient temperature : ta[ ] output voltage : vout[v] . -40c 25c 125c -40c 25c 125c downloaded from: http:///
datasheet d a t a s h e e t . 8/24 tsz02201-0g1g0an00480-1-2 ? 2015 rohm co., ltd. all rights reserved. 10.nov.2015 rev.001 tsz22111 ? 15 ? 001 bd3020hfp BD3021HFP www.rohm.com reference data unless otherwise specified, ta = 25 c, v cc = 13.5 v, v clk = gnd -3 -1 1 3 5 7 9 0 . 00 . 51 . 01 . 52 . 02 . 53 . 0 c t pin vol tage : vc t[v] c tpin cu rrent: i ctc, ctd [ a ] figure 13. detection voltage (v cc =v out ) figure 14. ct pin charge / discharge current (v cc =5v) figure 15. reset detection voltage vs. temperature figure 16. wdt time vs. temperature (c ct =0.01 f) 0 2 4 6 8 10 012345 ou tpu t vol tage : vou t[v] reset voltage : vreset[v] . bd3020hfp BD3021HFP -40c 25c 125c 3.8 4 4.2 4.4 4.6 4.8 -40 0 40 80 120 detection voltage : vdet[v] : a[ ] BD3021HFP bd3020hfp vdet vdet vhs vhs wdt: t wl, h [ms] 0 1 2 3 4 5 6 -40 0 40 80 120 ambient temperature : ta[ ] t wh t wl downloaded from: http:///
datasheet d a t a s h e e t . 9/24 tsz02201-0g1g0an00480-1-2 ? 2015 rohm co., ltd. all rights reserved. 10.nov.2015 rev.001 tsz22111 ? 15 ? 001 bd3020hfp BD3021HFP www.rohm.com . . . . . . . . . . . . . . . . . . . . . m . . . . . . . . . . . . . . . . . . . . . measurement circuits (bd3020hfp) measurement setup for figure 5. measurement setup for figure 7, 11, 12. measurement setup for figure 8. measurement setup for figure 9. measurement setup for figure 10. measurement setup for figure 6. measurement setup for figure 13, 15. measurement setup for figure 14. measurement setup for figure 16. . . . . . . . . . . . . . . . . . . . . . downloaded from: http:///
datasheet d a t a s h e e t . 10/24 tsz02201-0g1g0an00480-1-2 ? 2015 rohm co., ltd. all rights reserved. 10.nov.2015 rev.001 tsz22111 ? 15 ? 001 bd3020hfp BD3021HFP www.rohm.com . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . m . . . . . . . . . . . . . . . . . . . . . measurement circuits (BD3021HFP) measurement setup for figure 5. measurement setup for figure 7, 11, 12. measurement setup for figure 8. measurement setup for figure 9. measurement setup for figure 10. measurement setup for figure 6. measurement setup for figure 13, 15. measurement setup for figure 14. measurement setup for figure 16. downloaded from: http:///
datasheet d a t a s h e e t . 11/24 tsz02201-0g1g0an00480-1-2 ? 2015 rohm co., ltd. all rights reserved. 10.nov.2015 rev.001 tsz22111 ? 15 ? 001 bd3020hfp BD3021HFP www.rohm.com bd3020hfp detection voltage adjustment (resistance value is typical value) ic internal block diagram when typical detection voltage is 4.1 v vdet vs (r1 + r2) / r1 ? vdet : reset detection voltage ? vs : internal reference voltage (mos input) ? r1, r2 : ic internal resistor (voltage detection precision is tightened up to 2 % by laser-trimming the r1 and r2) vs will fluctuate 1.23 v 6.0 %. the reset detection voltage can be adjusted by connecting resistors on the vs terminal. insert pull down resistor r3 (lower resistance than r1) in between vs-gnd, and pull down resistor r4 (lower resistance than r2) in between vs-vout to adjust the detection voltage. by doing so, the detection voltage can be adjusted by the calculation below. vdet = vs [{r2 r4 / (r2 + r4)} + {r1 r3 / (r1 + r3)}] / {r1 r3 / (r1+r3)} when the output resistance value is as small enough to ignore t he ic internal resistance, you can find the detection voltage by the calculation below. vdet vs (r3 + r4 ) / r3 adjust the resistance value by application as the ci rcuit current will increase due to the added resistor. vout vout vout r4r3 vs 10 k ? r2 = 900 k ? r1 = 330 k ? vs 1.23 v 1 k ? 470 k ? reset downloaded from: http:///
datasheet d a t a s h e e t . 12/24 tsz02201-0g1g0an00480-1-2 ? 2015 rohm co., ltd. all rights reserved. 10.nov.2015 rev.001 tsz22111 ? 15 ? 001 bd3020hfp BD3021HFP www.rohm.com bd3020/21hfp power on reset / watchdog timer power on reset (output delay time) is adjustable by ct pin capacitor. t dlh (s) (1.15 v ct capacitance ( f)) / ictc ( a) (typ) ? t dlh : output delay time ( power on reset) ? 1.15 v : upper switching threshold voltage (typ) ? ct capacitance : capacitor connected to ct pin ? ictc : wdt charge current calculation example) with 0.01 f ct pin capacitor t dlh (s) = 1.15 v 0.01 f / 6 a 1.9 ms *if the ct capacitance is not the same as the condition on the electrical characteristics table, i.e., 0.01 f, choose the capa citance value in ratio referring to the above equation. watch dog timer ( wdt t wh , t wl ) is adjustable by the ct pin capacitor t wh (s) 1.00 v ct capacitance ( f)) / ictd( a) (typ) t wl (s) 1.00 v ct capacitance ( f)) / ictc( a) (typ) ? t wh : watchdog monitor time low (delay time to turn the reset on) ? t wl : watchdog reset time (time the reset is on) ? 1.00 v : upper switching threshold voltage - lower switching threshold voltage ? ct capacitance : ct pin capacitor *shared with power on reset ? ictc : wdt charge current ? ictd : wdt discharge current calculation example) with 0.01 f ct pin capacitor t wh (s) 1.00 v 0.01 f / 2 a 5.0 ms (typ) t wl (s) 1.00 v 0.01 f / 6 a 1.7 ms (typ) *if the ct capacitance is not the same as the condition on the electrical characteristics table, i.e., 0.01 f, choose the capa citance value in ratio referring to the above equation. vcc vout vout ct clk reset 13.5v 4.0v 4.60 (BD3021HFP) vdet=4.50 vhs 100mv (BD3021HFP) ct pull up voltage reset on t dl h (power on reset) reset on t dl h (power on reset) 4.20 (bd3020hfp) vdet=4.10 100mv (bd3020hfp) 3v0v 5v 0v 1.25v 1.15v 0.15v 0v0v 0v 4.0v reset on downloaded from: http:///
datasheet d a t a s h e e t . 13/24 tsz02201-0g1g0an00480-1-2 ? 2015 rohm co., ltd. all rights reserved. 10.nov.2015 rev.001 tsz22111 ? 15 ? 001 bd3020hfp BD3021HFP www.rohm.com wdt timer on / off switch in h (resistance value is typical value) BD3021HFP has a switch inh to turn the wdt on / off. ic internal block diagram by using inh on, ct potential can be pulled up to internal voltage vref_r (invalid with power on reset). BD3021HFP low wdt on wdt off high inh on/off ct 500k ? vref_r (typ 1.25v) external capacito r 10k ? lower switching threshold voltage wdt on 13.5v vcc vout inh ct clk reset 0v0v 5v0v 5v 1.25v 1.15v 0.15v 0v0v 5v0v vout the ct pin is pulled up after ct pin is charged. the ct pin is pulled up the ct pin is pulled up ct pull up voltgge upper switching threshold voltage the ct pin is pulled up downloaded from: http:///
datasheet d a t a s h e e t . 14/24 tsz02201-0g1g0an00480-1-2 ? 2015 rohm co., ltd. all rights reserved. 10.nov.2015 rev.001 tsz22111 ? 15 ? 001 bd3020hfp BD3021HFP www.rohm.com bd3020hfp watch time 4.20 v vhs 100mv clk width<500ns minimum reset movement voltage 13.5v 4.0v detect positive edge. the clk pin charges discharge to chaeging. vcc vout ct clk reset 5v3v 0v 5v 0v 1.25v 1.15v 0.15v 0v0v vout 0v power on reset wdt reset time power on reset reset on reset on reset on 4.10 v 4.0v downloaded from: http:///
datasheet d a t a s h e e t . 15/24 tsz02201-0g1g0an00480-1-2 ? 2015 rohm co., ltd. all rights reserved. 10.nov.2015 rev.001 tsz22111 ? 15 ? 001 bd3020hfp BD3021HFP www.rohm.com BD3021HFP watch time vhs100mv wdt off(inh=on) clk width<500ns wdt reset time minimum reset movement voltage reset on power on reset vcc 13.5v reset on reset on detect positive edge. detect positive edge. 5.5v 5v3v 0v vout inh ct clk reset 5v0v 5v 0v 1.25v 1.15v 0.15v 0v0v vout 0v 4.60v 4.50v 4.0v 4.0v power on reset downloaded from: http:///
datasheet d a t a s h e e t . 16/24 tsz02201-0g1g0an00480-1-2 ? 2015 rohm co., ltd. all rights reserved. 10.nov.2015 rev.001 tsz22111 ? 15 ? 001 bd3020hfp BD3021HFP www.rohm.com . . . . . . . pin settings / precautions 1. vcc pin insert a 0.33 f to 1000 f capacitor between the vcc and gnd. the appropriate capacitance value varies b y application. be sure to allow a sufficient margin for input voltage levels. 2. output pins in order to prevent oscillation, a capacitor needs to be placed between the output pin a nd gnd. we recommend using a capacitor with a capacitance of 0.1 f to 1000 f. elec trolytic, tantalum and ceramic capacitors can be used. when selecting the capacitor ensure t hat the capacitance of 0.1f to 1000f is maintained at the intended applied voltage and temperature range. due to changes in temperature the capacitors capacitance can fluctuate possibly resulting in oscillation. for selection of the capacitor refer to the cout_esr vs. io data. the stable operat ion range given in the reference data is based on the standalone ic and resistive load. for actual applications the stable operating range is influenced by the pcb impedance, input supply impedance and load impedance. therefore verification of the final operating environment is needed. also, in case of rapidly changing input voltage and load curr ent, select the capacitance in accordance with verifying that the actual application meets with the required specification. output capacitor_esr vs io (reference data) *pin settings / precautions2 measurement circuit 3. ct pin connecting a capacitance of 0.01 f to 1 f on the ct pin is recommended. v cc = 5.6 v to 36 v ta = -40 c to +125 c io = 0 a to 500 ma c in = 0.33 f to 100 f, c out = 0.1 f to 100 f . . . m aaci_ ? unstable operating region stable operating region downloaded from: http:///
datasheet d a t a s h e e t . 17/24 tsz02201-0g1g0an00480-1-2 ? 2015 rohm co., ltd. all rights reserved. 10.nov.2015 rev.001 tsz22111 ? 15 ? 001 bd3020hfp BD3021HFP www.rohm.com power dissipation hrp7 ic mounted on rohm standard board. board material: fr4 board size: 70.0 mm 70.0 mm 1.6 mmt (with thermal via on the board) mount condition: pcb and exposed pad are soldered. top copper foil: the footprint rohm recommend. + wiring to measure. p : 1-layer pcb (back surface copper foil area : 0mm 0 mm) q : 4-layer pcb (back surface copper foil area : 70.0mm 70.0 mm) condition p : ja = 78.1 c / w condition q : ja = 17.1 c / w figure 17. package data (hrp7) refer to figure 17 thermal dissipation characteristics for usag e above ta = 25 c. the ics characteristics are affected heavily by the temperature, and if is ex ceeds its max junction temperature (tjmax), the chip may degrade or destruct. thermal design is critical in terms of avoiding inst antaneous destruction and reliability in long term usage. the ic needs to be operated below its max junction temperature (tjmax) to avoid thermal destruction. refer to figure 17 for hrp7 package thermal dissipation characte ristics. operate the ic within power dissipation (pd) when using this ic. power consumption pc (w) calculation will be as below pc = (v cc - v out ) io + v cc icc power dissipation pd pc if load current io is calculated to operate within power dissipati on, it will be as below, where you can find the max load curr ent io max for the applied voltage v cc of the thermal design. (refer to figure 6 for the icc) example) at ta = 125 c, v cc = 12 v, v out = 5 v at ta = 125 c with figure 17 condition, the calculation show s that ca 207 ma of output curr ent is possible at 7 v potential difference across input and output. v cc : input voltage v out : output voltage io : load current icc : circuit current v cc - v out pd - v cc icc io ja = 17.1 c / w -58.4 mv / c 25 c = 7.30 w 125 c = 1.452 w 1.6 w 7.3 w 0 0 2 4 6 8 10 0 2 55 07 51 0 01 2 51 5 0 power dissipation: pd[w] ambient temperature: ta[c] io 207 ma (icc: 150 a) io 1.452 - 12 icc 12 - 5 downloaded from: http:///
datasheet d a t a s h e e t . 18/24 tsz02201-0g1g0an00480-1-2 ? 2015 rohm co., ltd. all rights reserved. 10.nov.2015 rev.001 tsz22111 ? 15 ? 001 bd3020hfp BD3021HFP www.rohm.com i/o equivalence circuit (resistance value is typical value) clk (1pin) vs (bd3020hfp 2pin) inh (BD3021HFP 2pin) vcc (3pin) k ? k ? vout (5pin) reset (6pin) ct (7pin) figure 18. i / o equivalence circuit downloaded from: http:///
datasheet d a t a s h e e t . 19/24 tsz02201-0g1g0an00480-1-2 ? 2015 rohm co., ltd. all rights reserved. 10.nov.2015 rev.001 tsz22111 ? 15 ? 001 bd3020hfp BD3021HFP www.rohm.com operational notes 1. electrical characteristics electrical characteristics described in these specifications may vary, dependi ng on temperature, supply voltage, external circuits and other conditions. therefore, be sure to check all relevant fact ors, including transient characteristics. 2. reverse connection of power supply connecting the power supply in reverse polarity can damage the ic. take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the ics power supply pins. 3. power supply lines design the pcb layout pattern to provide low impedance s upply lines. separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital bl ock from affecting the analog block. furthermore, connect a capacitor to ground at all po wer supply pins. consider t he effect of temperature and aging on the capacitance value when using electrolytic capacitors. 4. ground voltage ensure that no pins are at a voltage below that of t he ground pin at any time, even during transient condition. 5. ground wiring pattern when using both small-signal and large-current ground traces , the two ground traces should be routed separately but connected to a single ground at the refer ence point of the application board to av oid fluctuations in the small-signal ground caused by large currents. also ensure that the grou nd traces of external components do not cause variations on the ground voltage. the ground lines must be as s hort and thick as possible to reduce line impedance. 6. thermal consideration should by any chance the power dissipation rating be exceed ed the rise in temperature of the chip may result in deterioration of the properties of the chip. in case of exceeding this abs olute maximum rating, increase the board size and copper area to prevent exceeding the pd rating. use a thermal design that allows for a sufficient margin in light of the pd in actual operating conditions. consider pc that does not exceed pd in actual operating conditions. (pd pc) tjmax: maximum junction temperature = 150 c, ta: peripheral temperature [c], ja: thermal resistance of package-ambience [ c / w], pd : package power dissipation [w], pc: power dissipation [w], v cc : input voltage, v out: output voltage, io: load, i cc2 : bias current2 package power dissipation : pd (w) = (tjmax - ta) / ja power dissipation : pc (w) = (v cc - v out ) io + v cc i cc2 7. inrush current when power is first supplied to the ic, it is possi ble that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the ic has more than one power supply. therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiri ng, and routing of connections. 8. testing on application boards when testing the ic on an application board, connecting a capacitor directly to a low-impedance output pin may subject the ic to stress. always discharge capacitors comp letely after each process or step. the ics power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. to prevent damage from static discharge, ground the ic during assembly and use similar precautions during transport and storage. 9. inter-pin short and mounting errors ensure that the direction and position are correct when mounting the ic on the pc b. incorrect mounting may result in damaging the ic. avoid nearby pins being shorted to each ot her especially to ground, power supply and output pin. inter-pin shorts could be due to many reasons such as meta l particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. 10. unused input pins input pins of an ic are often connected to the gate of a mos transis tor. the gate has extremely high impedance and extremely low capacitance. if left unconnected, the electric fi eld from the outside can easily charge it. the small charge acquired in this way is enough to produce a significant effect on the conduction thr ough the transistor and cause unexpected operation of the ic. so unless otherwise specif ied, unused input pins should be connected to the power supply or ground line. downloaded from: http:///
datasheet d a t a s h e e t . 20/24 tsz02201-0g1g0an00480-1-2 ? 2015 rohm co., ltd. all rights reserved. 10.nov.2015 rev.001 tsz22111 ? 15 ? 001 bd3020hfp BD3021HFP www.rohm.com operational notes C continued 11. regarding the input pin of the ic this monolithic ic contains p+ isolation and p substrat e layers between adjacent elements in order to keep them isolated. p-n junctions are formed at the intersection of the p layers with the n layers of other elements, creating a parasitic diode or transistor. for example (refer to figure below): when gnd > pin a and gnd > pin b, the p-n j unction operates as a parasitic diode. when gnd > pin b, the p-n junction operates as a parasitic transistor. parasitic diodes inevitably occur in the structure of the ic. the operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical dam age. therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the gnd voltage to an input pin (and thus to the p substrate) should be avoided. figure 19. example of monolithic ic structure 12. thermal shutdown circuit(tsd) this ic has a built-in thermal shutdown circuit that prev ents heat damage to the ic. normal operation should always be within the ics power dissipation rating. if however the rating is exceeded for a continued period, the junction temperature (tj) will rise which will activate the tsd circui t that will turn off all output pins. when the tj falls below the tsd threshold, the circuits are automatically restored to normal operation. note that the tsd circuit operates in a situation that exceed s the absolute maximum rati ngs and therefore, under no circumstances, should the tsd circuit be used in a set design or for any purpose other t han protecting the ic from heat damage. 13. over current protection circuit (ocp) this ic incorporates an integrated over current protection circuit that is acti vated when the load is shorted. this protection circuit is effective in preventing damage due to sudden and unexpected incidents. however, the ic should not be used in applications characterized by continuous operation or transit ioning of the protection circuit. 14. applications or inspection processes where the potential of the vcc pin or other pins may be reversed from their normal state may cause damage to the ic's internal circuitry or elements. use an output pin capacitance of 100 0f or lower in case vcc is shorted with the gnd pin while the external capacitor is charged. i nsert a diode in series with vcc to prevent reverse current flow, or insert bypass diodes between vcc and each pin. 15. positive voltage surges on vcc pin a power zener diode should be inserted between vcc and gnd for protection against voltage surges of more than 50 v on the vcc pin. figure 20. application examples 1 16. negative voltage surges on vcc pin a schottky barrier diode should be inserted between vcc and gnd for protection against voltages lower than gnd on the vcc pin. figure 21. application examples 2 downloaded from: http:///
datasheet d a t a s h e e t . 21/24 tsz02201-0g1g0an00480-1-2 ? 2015 rohm co., ltd. all rights reserved. 10.nov.2015 rev.001 tsz22111 ? 15 ? 001 bd3020hfp BD3021HFP www.rohm.com operational notes C continued 17. output protection diode loads with large inductance components may cause reverse current flow during startup or shutdown. in such cases, a protection diode should be inserted on the output to protect the ic. figure 22. application examples 3 downloaded from: http:///
datasheet d a t a s h e e t . 22/24 tsz02201-0g1g0an00480-1-2 ? 2015 rohm co., ltd. all rights reserved. 10.nov.2015 rev.001 tsz22111 ? 15 ? 001 bd3020hfp BD3021HFP www.rohm.com physical dimension, tape and reel information package name hrp7 direction of feed 1pin reel ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tapequantity direction of feed the direction is the 1pin of product is at the upper right when you hold reel on the left hand and you pull out the tape on the right hand 2000pcs tr ( ) downloaded from: http:///
datasheet d a t a s h e e t . 23/24 tsz02201-0g1g0an00480-1-2 ? 2015 rohm co., ltd. all rights reserved. 10.nov.2015 rev.001 tsz22111 ? 15 ? 001 bd3020hfp BD3021HFP www.rohm.com marking diagram product name part number marking bd3020hfp bd3020 BD3021HFP bd3021 hrp7 (top view) part number marking lot number 1pin mark downloaded from: http:///
datasheet d a t a s h e e t . 24/24 tsz02201-0g1g0an00480-1-2 ? 2015 rohm co., ltd. all rights reserved. 10.nov.2015 rev.001 tsz22111 ? 15 ? 001 bd3020hfp BD3021HFP www.rohm.com revision history date revision changes 10.nov.2015 001 new release downloaded from: http:///
notice-paa-e rev.002 ? 201 5 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. if you intend to use our products in devices requiring extreme ly high reliability (such as medical equipment (note 1) , aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life , bodily injury or serious damage to property ( specific applications ), please consult with the rohm sales representative in advance. unless otherwise agreed in writin g by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any rohm s products for specific applications. (note1) medical equipment classification of the specific applic ations japan usa eu china class class class b class class ? class 2. rohm designs and manufactures its products subject to stri ct quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequ ate safety measures including but not limited to fail-safe desig n against the physical injury, damage to any property, whic h a failure or malfunction of our products may cause. the followi ng are examples of safety measures: [a] installation of protection circuits or other protective devic es to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are not designed under any special or ex traordinary environments or conditions, as exemplified below . accordingly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any rohms products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or c onditions (as exemplified below), your independent verification and confirmation of product performance, reliabil ity, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, including water, oils, chemicals, and organ ic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products are e xposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed t o static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing component s, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subject to radiation-proof design. 5. please verify and confirm characteristics of the final or mou nted products in using the products. 6 . in particular, if a transient load (a large amount of load appl ied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mou nting is strongly recommended. avoid applying power exceeding normal rated power; exceeding the power rating u nder steady-state loading condition may negatively affec t product performance and reliability. 7 . de -rate power dissipation depending on ambient temperature. wh en used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8 . confirm that operation temperature is within the specified range desc ribed in the product specification. 9 . rohm shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlorine, bromine, etc .) flux is used, the residue of flux may negatively affect prod uct performance and reliability. 2. in principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method mu st be used on a through hole mount products. i f the flow soldering method is preferred on a surface-mount p roducts, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification downloaded from: http:///
notice-paa-e rev.002 ? 201 5 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, p lease allow a sufficient margin considering variations o f the characteristics of the products and external components, inc luding transient characteristics, as well as static characteristics. 2. you agree that application notes, reference designs, and a ssociated data and information contained in this docume nt a re presented only as guidance for products use. therefore, in case you use such information, you are solely responsible for it and you must exercise your own independ ent verification and judgment in the use of such information contained in this document. rohm shall not be in any way respon sible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such informat ion. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take pr oper caution in your manufacturing process and storage so t hat voltage exceeding the products maximum rating will not be applied to products. please take special care under dry co ndition (e.g. grounding of human body / equipment / solder iro n, isolation from charged objects, setting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriorate if the products are stored in the places where: [a] the products are exposed to sea winds or corrosive gases, in cluding cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to direct sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage condition, solderabil ity of products out of recommended storage time period may be degraded. it is strongly recommended to confirm so lderability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the correct direction, which is indi cated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a c arton. 4. use products within the specified time after opening a humi dity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage tim e period. precaution for product label qr code printed on rohm products label is for rohm s internal use only. precaution for disposition when disposing products please dispose them properly usi ng an authorized industry waste company. precaution for foreign exchange and foreign trade act since concerned goods might be fallen under listed items of export control prescribed by foreign exchange and foreign trade act, please consult with rohm in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to appl ication example contained in this document is for reference only. rohm does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. rohm shall not have any obligations where the claims, a ctions or demands arising from the combination of the products with other articles such as components, circuits, systems or ex ternal equipment (including software). 3. no license, expressly or implied, is granted hereby under any in tellectual property rights or other rights of rohm or any third parties with respect to the products or the information contai ned in this document. provided, however, that rohm will not assert its intellectual property rights or other rights a gainst you or your customers to the extent necessary to manufacture or sell products containing the products, subject to th e terms and conditions herein. other precaution 1. this document may not be reprinted or reproduced, in whole or in p art, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any way whatsoever the pr oducts and the related technical information contained in the products or this document for any military purposes, includi ng but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties. downloaded from: http:///
datasheet datasheet notice ? we rev.001 ? 2015 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. downloaded from: http:///

▲Up To Search▲

Price & Availability of BD3021HFP

	To Download BD3021HFP Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .